COM Cooling Solutions
The specifications for Qseven, COM Express and SMARC include heatspreader definitions, the mechanical thermal interface. All the heat generated by power consuming components such as chipsets and processors is transferred to the system’s cooling via the heatspreader. This can be achieved by either a thermal connection to the casing, a heat pipe or a heat sink
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|congatec’s smart cooling pipes pave the way for unlimited performance growth for COM Express modules|
The congatec heatspreaders and cooling solutions for the high performance modules are feature heatpipes in order to boost performance and reliability. A copper block is mounted on the chip to absorb heat and to mitigate the effects of thermal peaks. Between the chip and the copper block, a phase-change material is placed to improve the heat transmission. To account for different component heights and manufacturing tolerances, the copper block is spring loaded to apply an optimized pressure to the silicon dye. The copper block and the cooling fins or heat plate are connected by flexible flat heatpipes. The heat pipe is attached directly to the cooling blocks on the chip and the heatspreader plate. As a result, more heat is transported from the processor environment to the heatspreader, hot spots are cooled more quickly and therefore the processor is optimally cooled. The heatpipe adapter uses the same principals as described above but transmits the heat from the module directly to standard heat pipes with 8mm diameter. This approach allows for cost optimized, ultra-flat system solutions i.e. 1 U rack units.
|Cooling solutions for Qseven and SMARC|
The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.
The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.
COM Express Type 7 Basic module based on the latest Intel® Xeon™ and Intel® Pentium™ processor family
COM Express Type 7 Basic module based on Intel® Xeon® D processor series (code name "Ice Lake")
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
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