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Embedded computing with 8th generation Intel Core Mobile processors
The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.
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Rugged 10 GbE infrastructure equipment
The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.
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Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
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康佳特推出Micro-ATX规格尺寸的高性能COM-HPC载板
嵌入式和边缘计算技术的领先供应商德国康控(congatec) 推出首款支持COM-HPC接口的Micro-ATX 载板，正式进军高端工业工作站(Industrial Workstation)和台式机客户端(desktop client) 市场。该板是专为嵌入式长期可用性而设计(至少七年)，它排除了标准或半定制工业主板的设计风险、修订要求和供应链的不确定性；一般标准主板或半工业级主板通常只能提供三到五年供货期。由于该载板是独立于处理器插座和供应商的，且支持COM-HPC Client Size A、B或C中的任何高端计算机模块，这使OEM的设计更具灵活和可持续性。
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- 2022-08-24康佳特透过i.MX 8M Plus处理器简化Arm部署
- 2022-08-24符合《COM-HPC载板设计指南》的生态系统
- 2022-08-24康佳特发布高层管理团队异动 以促进公司成长
- 2022-08-24康佳特虚拟展台提供实时互动信息交流
- 2022-08-24congatec推出全新10款搭载第12代英特尔酷睿处理器的COM-HPC和COM Express计算机模块
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- 2022-08-24首款具有x86混合架构并带来核心数量的飞跃
- 2022-08-24首款具有x86混合架构并带来核心数量的飞跃