粤公网安备 44030502000575号服务热线
400-000-0000
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conga-TS370
COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family
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conga-TS570
COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H")
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conga-B7AC
COM Express Type 7 Basic module based on the latest Intel® Atom C3000 processor family
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conga-MA4
COM Express® Mini Type 10 module based on 4th Generation Intel® Atom™ processors
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conga-MA3E
COM Express® Mini Type 10 模块
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conga-MA3
COM Express® Mini Type 10 模块
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conga-IC370
Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"
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conga-IC175
Highest Performance Thin-Mini-ITX board based on 7th Generation Intel® Core™ Mobile SOC U-Processors
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conga-IC170
Highest Performance Thin-Mini-ITX board based on 6th Generation Intel® Core™ Mobile SOC U-Processors
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conga-IA5
Industrial Thin Mini-ITX based on 5th Generation Intel® Atom™, Intel® Celeron® and Pentium® Processors
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conga-HPC/sILL
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
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conga-HPC/sILH
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
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conga-HPC/cTLU
COM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake")
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conga-HPC/cTLH
COM-HPC Client Size B high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake-H")
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conga-HPC/cALS
COM-HPC Client Size C high performance module based on 12th Gen Intel® Core™ processor series (code name "Alder Lake")
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conga-HPC/cALP
COM-HPC Client Size A high performance module based on 12th Gen Intel® Core™ processor series (code name "Alder Lake")
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conga-B7XI
COM Express Type 7 Basic module based on Intel® Xeon® D processor series (code name "Ice Lake")
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conga-B7XD
COM Express Type 7 Basic module based on the latest Intel® Xeon™ and Intel® Pentium™ processor family
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conga-B7AC
COM Express Type 7 Basic module based on the latest Intel® Atom C3000 processor family
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Embedded computing with 8th generation Intel Core Mobile processors
The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.
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Rugged 10 GbE infrastructure equipment
The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.
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Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
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康佳特推出Micro-ATX规格尺寸的高性能COM-HPC载板
嵌入式和边缘计算技术的领先供应商德国康控(congatec) 推出首款支持COM-HPC接口的Micro-ATX 载板，正式进军高端工业工作站(Industrial Workstation)和台式机客户端(desktop client) 市场。该板是专为嵌入式长期可用性而设计(至少七年)，它排除了标准或半定制工业主板的设计风险、修订要求和供应链的不确定性；一般标准主板或半工业级主板通常只能提供三到五年供货期。由于该载板是独立于处理器插座和供应商的，且支持COM-HPC Client Size A、B或C中的任何高端计算机模块，这使OEM的设计更具灵活和可持续性。
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