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行业应用

COMs: COM-HPC; COM Express Type 7; COM Express Type 6; COM Express Type 10; SMARC; Qseven

SBC: Mini ITX; Pico ITX; 3.5" SBC

CPU: Intel; Core 12th Gen; AMD; EPYC 3000; NXP; i.MX8; min. 4 CPU Cores; min. 8 CPU Cores; max. 10 W TDP; min. 3 GHz Cloc

By Feature: Server Class; Small Size; 2x Ethernet; 10 Gb Ethernet; Extended Temp; min.8 CPU Cores; Legacy Products; 产品指南

Ecosystem: 配件; Eval Carrier Boards; Mini Carrier Boards; DRAM; Eval-Kits

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Embedded computing with 8th generation Intel Core Mobile processors

The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.

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Rugged 10 GbE infrastructure equipment

The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.

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Device development with SMARC 2.0

SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.

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康佳特推出Micro-ATX规格尺寸的高性能COM-HPC载板 嵌入式和边缘计算技术的领先供应商德国康控(congatec) 推出首款支持COM-HPC接口的Micro-ATX 载板，正式进军高端工业工作站(Industrial Workstation)和台式机客户端(desktop client) 市场。该板是专为嵌入式长期可用性而设计(至少七年)，它排除了标准或半定制工业主板的设计风险、修订要求和供应链的不确定性；一般标准主板或半工业级主板通常只能提供三到五年供货期。由于该载板是独立于处理器插座和供应商的，且支持COM-HPC Client Size A、B或C中的任何高端计算机模块，这使OEM的设计更具灵活和可持续性。: 2022-08-24congatec荣获VDC Research颁发的物联网&嵌入式硬件技术供应商满意度铂金奖; 2022-08-24实现机器人边缘计算模块化; 2022-08-24高性能被动散热模块; 2022-08-24congatec进军功能安全(FuSa)市场; 2022-08-24迈向混合关键实时服务器市场; 2022-08-24康佳特透过i.MX 8M Plus处理器简化Arm部署; 2022-08-24符合《COM-HPC载板设计指南》的生态系统; 2022-08-24康佳特发布高层管理团队异动以促进公司成长; 2022-08-24康佳特虚拟展台提供实时互动信息交流; 2022-08-24congatec推出全新10款搭载第12代英特尔酷睿处理器的COM-HPC和COM Express计算机模块; 2022-08-24康佳特與SYSGO合作; 2022-08-24全新Qseven 升级: NXP i.MX 8; 2022-08-24德国康佳特深耕中国医疗市场; 2022-08-24采用NXP i.MX 8M Plus处理器的康佳特SMARC 2.1模块; 2022-08-24首款具有x86混合架构并带来核心数量的飞跃; 2022-08-24首款具有x86混合架构并带来核心数量的飞跃

日本IT周秋季-物联网和5G在日本东京举行 10月26 -28日，日本东京本届展会是最大的IT贸易展会，包括11个专业展会，如物联网和5G解决方案博览会、嵌入式和边缘计算博览会、信息安全博览会、云和BPR博览会、数据中心和存储博览会、销售自动化和CRM博览会、Web和数字营销博览会、先进电子商务和零售博览会、AI和商业自动化博览会、软件和应用程序开发博览会和自动化系统运营博览会。: 2022-08-28ETN -嵌入式会议芬兰召开; 2022-08-28E-22在丹麦最大的电子产品交易会亮相; 2022-08-282022年华沙Evertiq世博会

相关产品推荐

conga-B7XD

COM Express Type 7 Basic module based on the latest Intel® Xeon™ and Intel® Pentium™ processor family

conga-B7AC

COM Express Type 7 Basic module based on the latest Intel® Atom C3000 processor family

conga-B7E3

COM Express Basic Type 7 Server Class module based on AMD EPYC™ 3000 processor series

conga-B7XI

COM Express Type 7 Basic module based on Intel® Xeon® D processor series (code name "Ice Lake")

conga-HPC/sILL

COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")

conga-HPC/cALS

COM-HPC Client Size C high performance module based on 12th Gen Intel® Core™ processor series (code name "Alder Lake")

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